Ipc-7093a Pdf Jun 2026

Z-axis expansion (CTE) differs between the rigid and flex sections. The guide helps assemblers predict how the board will behave during solder reflow, ensuring vias don't crack and components stay secure.

IPC-7093A addresses solder voiding and thermal pad management in Bottom Termination Components (BTCs) by recommending Solder Mask Defined (SMD) pads. This approach uses solder mask to create dams around thermal vias, reducing solder wicking and preventing excessive voiding without requiring expensive via plugging. The standard also advises windowpane stencil designs to improve component mounting and overall thermal performance. View the document details at IPC-7093A: Solder Mask for BTC QFN Pads | PDF - Scribd ipc-7093a pdf